OpenCPI - Introduction

The OpenCPI Technical Summary is a common starting point to understanding what OpenCPI actually is and does. The OpenCPI Technical Summary provides an overview of OpenCPI, its technology, and architecture. The document also provides common introductory material for the other OpenCPI documents.

The key attributes of OpenCPI as presently constituted are:

• Infrastructure, in software and gateware, to support component-based applications on heterogeneous embedded systems.
• Portability and runtime interoperability among components authored for FPGAs, DSPs, GPPs, (and GPUs — in progress).
• Support for using X-Midas-based algorithms (Intel Community SIGINT toolkit)
• Easily adapted to support high-level component-based environments such as DoD SCA/SDR and ISO CCM.
• Easily adapted to support a wide range of data transport technologies ranging from simple wires between chips to high-level middlewares such as DDS and CORBA.
• Architected for high bandwidth, high utilization embedded applications, including CREW/CIED, EO/IR Sensor processing, SATCOM, etc.

These attributes produce the following benefits for embedded systems developers:

• Technology agility to select, change, upgrade, mix processing technologies to stay with best of breed technologies, meet SWAP constraints, and fit the technology to the application(s).
• Diversity of component/algorithm authoring models to exploit existing external modules (e.g. FPGA or X-Midas primitives), and anticipate technology migration of algorithms.
• Improve risk and time-to-deployment when integrating capabilities developed by different organizations, or reused from previous deployments.